Additive manufacturing (AM) is a transformative technology changing how we design and pro- duce products and components. The AM process involves depositing or sintering material layer by layer, which requires careful control of the process’s thermal and mechanical aspects. While AM offers many advantages over traditional manufacturing methods, it also presents unique challenges, such as thermal and mechanical instabilities that can result in poor part quality [1, 2]. Therefore, it is essential to thoroughly understand the interplay between thermal and mechanical aspects in AM. Our contribution presents a comprehensive coupled thermo-mechanical analysis of the AM pro- cess. We aim to gain a deeper understanding of the interdependence between thermal and me- chanical phenomena in AM and to explore the impact of these phenomena on the final printed part. Our analysis considers various factors, such as temperature-dependent material properties, layer thickness, build orientation, and processing conditions. Using a combination of numeri- cal simulations and experimental methods, we examine and verify the material’s temperature distribution, thermal gradients, residual stresses, and mechanical properties during printing [3]. Results show that the thermal and mechanical aspects of the AM process are closely interlinked and can significantly impact part quality. For example, our work highlights the importance of controlling the thermal energy input during printing to reduce residual stresses and improve mechanical performance. Additionally, our results demonstrate that the thermal gradients gen- erated during printing can affect the printed part’s mechanical behavior and final dimensions. In conclusion, the results provide important insights into the complex nature of thermal and mechanical aspects in AM. Furthermore, our findings show that a coupled thermo-mechanical analysis of the 3D printing process is indispensable for improving process control, reducing defects, and enhancing part quality. Therefore, we expect to contribute to the continued devel- opment and optimization of AM techniques and the expansion of their applications in various fields