Scheduled presentations:

• Keynote Stress-accurate FE framework for the numerical simulation of the FSW process
  M. Chiumenti*, H. Venghaus, J. Baiges, N. Dialami, M. Cervera, D. Juhre
• Thermo-mechanical coupling topology optimization of leading edge structures considering GH4099 additive manufacturing constraints
  H. Liu*, S. Zhu, J. Li, J. Lv
• Hot compression bonding of AA6061: A computational study of interface conditions and their relation to bond strength
  M. Kayat*, B. Mittelman, M. Ben-Haroush, I. Aloush, L. Mordechay, J. Bortman, E. Priel
• A thermomechanically fully coupled finite strain shape memory alloy model applied to bistable microactuators
  S. Wulfinghoff*, M. Hörsting